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AR Coating
AAS
Laser Welder
Wafer Scriber
Other facilities
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Major facilities include:
Thin Film Deposition for AR coating and HR Coating (ion beam assited ebeam deposition)
Precision fiber array alignment for packaging waveguide components
Laser Welder for TO-can and butterfly packages
Automatic Wafer scribe & dice
Class 1000 clean room
** Charging scheme
Other equipment include:
Polishing System
Auto-Stepback Wedge wirebonder
Precision Die Bonder
Key Technologies
Process development:
Laser welding
Precision fiber pigtailing
Fiber arrays
MEMs packaging
Wafer scriber
Adhesive
Au/Sn Eutectic
Flip chip
